SMT šiluminis profiliavimas

Rinkimosi profiliavimui reikalingas 4- fazės optimizavimas: pašildykite (1-3 laipsnis /s), mirk ({60-120 s ties 150-180 laipsniu), reflow (30-60} virš 217 laipsnio), aušinimo (<6°C/s). KIC thermal profilers use predictive algorithms for complex boards. Thermocouples attach to thermal mass areas for accuracy. Nitrogen environments permit 10°C lower peak temperatures. Ramp-to-spike profiles reduce tombstoning. DOE methods correlate profile settings with shear strength. Standards: IPC-7531 guidelines for profile validation.